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| source_id,topic_rank,subindustry,keyword_score,matched_keywords,evidence_type
| SRC-PANDA-SEMI-0001,1,半导体设备,243,半导体设备;光刻;刻蚀;薄膜沉积;CVD;PVD;量测;检测设备;离子注入,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0001,2,射频与连接芯片,32,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0001,3,半导体材料,20,光刻胶;硅片;掩膜版,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0001,4,晶圆制造,19,晶圆制造;先进制程;晶圆厂,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0001,5,数字计算与逻辑芯片,5,CPU;GPU,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0001,6,封装测试,3,先进封装,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0001,7,关键零部件与厂务,2,石英,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0001,8,传感器_MEMS与光电,1,传感器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0002,1,射频与连接芯片,3,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0003,1,射频与连接芯片,4,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0004,1,数字计算与逻辑芯片,60,CPU;GPU;NPU;算力芯片,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0004,2,射频与连接芯片,25,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0004,3,晶圆制造,3,先进制程,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0004,4,存储芯片,2,DRAM;HBM,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0004,5,芯片设计,2,SoC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0004,6,封装测试,1,HBM,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0005,1,射频与连接芯片,33,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0005,2,传感器_MEMS与光电,7,传感器;激光雷达,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0005,3,功率半导体,3,SiC;GaN,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0005,4,化合物半导体,3,SiC;GaN,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0005,5,数字计算与逻辑芯片,1,GPU,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0006,1,射频与连接芯片,25,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0006,2,数字计算与逻辑芯片,3,GPU;NPU,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0008,1,半导体设备,83,光刻;刻蚀;量测;离子注入,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0008,2,射频与连接芯片,29,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0008,3,半导体材料,19,光刻胶;硅片,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0008,4,功率半导体,10,功率器件;碳化硅;SiC;氮化镓;GaN,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0008,5,化合物半导体,10,化合物半导体;碳化硅;SiC;氮化镓;GaN,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0008,6,存储芯片,10,存储芯片;DRAM;NAND,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0008,7,数字计算与逻辑芯片,5,CPU;GPU;处理器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0008,8,传感器_MEMS与光电,2,传感器;激光雷达,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0008,9,晶圆制造,2,晶圆代工;先进制程,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0009,1,半导体设备,204,半导体设备;光刻;刻蚀;薄膜沉积;CVD;PVD;ALD;清洗设备;量测;检测设备;涂胶显影;离子注入;CMP,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0009,2,封装测试,94,封装测试;先进封装;Chiplet;HBM;测试机;探针台;封测,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0009,3,存储芯片,77,存储芯片;DRAM;NAND;存储器;HBM,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0009,4,晶圆制造,41,晶圆制造;制程节点;先进制程;成熟制程;晶圆厂,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0009,5,功率半导体,24,功率半导体;IGBT;MOSFET;功率器件;碳化硅;SiC;氮化镓,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0009,6,射频与连接芯片,24,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0009,7,传感器_MEMS与光电,14,MEMS;光模块,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0009,8,化合物半导体,9,碳化硅;SiC;氮化镓,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0009,9,关键零部件与厂务,7,半导体零部件;石英,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0009,10,数字计算与逻辑芯片,5,CPU;GPU;逻辑芯片;算力芯片,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0009,11,芯片设计,5,SoC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0009,12,半导体材料,3,半导体材料;光刻胶,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0009,13,模拟与混合信号,2,模拟芯片;PMIC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0010,1,数字计算与逻辑芯片,18,NPU;处理器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0010,2,射频与连接芯片,5,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0010,3,芯片设计,5,SoC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0010,4,存储芯片,1,存储芯片,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0010,5,晶圆制造,1,先进制程,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0011,1,射频与连接芯片,12,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0011,2,数字计算与逻辑芯片,4,GPU;NPU,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0011,3,芯片设计,2,芯片设计,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0011,4,半导体设备,1,半导体设备,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0011,5,晶圆制造,1,成熟制程,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0012,1,传感器_MEMS与光电,128,CIS;光模块,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0012,2,射频与连接芯片,81,射频芯片;PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0012,3,半导体设备,34,刻蚀;ALD;量测;检测设备,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0012,4,封装测试,16,封装测试;先进封装;测试机;探针台;封测,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0012,5,化合物半导体,9,化合物半导体;SiC;GaAs,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0012,6,功率半导体,8,功率半导体;SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0012,7,芯片设计,8,SoC;ASIC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0012,8,晶圆制造,1,晶圆制造,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0012,9,模拟与混合信号,1,ADC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0013,1,射频与连接芯片,9,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0013,2,半导体设备,1,ALD,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0013,3,晶圆制造,1,产能利用率,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0014,1,射频与连接芯片,7,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0015,1,射频与连接芯片,24,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0015,2,传感器_MEMS与光电,8,传感器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0015,3,晶圆制造,5,产能利用率,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0016,1,数字计算与逻辑芯片,6,CPU;NPU;处理器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0016,2,射频与连接芯片,4,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0016,3,芯片设计,2,SoC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0016,4,存储芯片,1,DRAM,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0017,1,射频与连接芯片,19,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0017,2,数字计算与逻辑芯片,2,GPU,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0017,3,芯片设计,2,芯片设计;ASIC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0017,4,功率半导体,1,SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0017,5,化合物半导体,1,SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0018,1,射频与连接芯片,20,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0018,2,数字计算与逻辑芯片,5,GPU,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0018,3,存储芯片,1,存储器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0020,1,晶圆制造,57,晶圆制造;晶圆代工;先进制程;晶圆厂,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0020,2,射频与连接芯片,32,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0020,3,半导体材料,31,半导体材料;光刻胶;电子特气;湿电子化学品;硅片;靶材;封装材料,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0020,4,半导体设备,29,半导体设备;光刻;刻蚀;量测;检测设备;CMP,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0020,5,封装测试,21,封装测试;先进封装;封测,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0020,6,关键零部件与厂务,6,洁净室,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0020,7,EDA与IP,1,EDA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0020,8,化合物半导体,1,化合物半导体,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0020,9,存储芯片,1,存储芯片,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0020,10,数字计算与逻辑芯片,1,处理器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0020,11,芯片设计,1,EDA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0021,1,射频与连接芯片,6,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0022,1,射频与连接芯片,9,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0022,2,传感器_MEMS与光电,2,传感器;激光雷达,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0022,3,半导体设备,1,半导体设备,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0023,1,射频与连接芯片,41,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0023,2,数字计算与逻辑芯片,15,CPU;GPU;处理器;算力芯片,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0023,3,芯片设计,12,芯片设计;SoC;ASIC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0023,4,功率半导体,10,SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0023,5,化合物半导体,10,SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0023,6,传感器_MEMS与光电,3,光模块,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0023,7,晶圆制造,2,晶圆厂,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0023,8,封装测试,1,先进封装,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0024,1,半导体设备,412,半导体设备;光刻;刻蚀;薄膜沉积;量测;检测设备;涂胶显影;离子注入;CMP,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0024,2,射频与连接芯片,53,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0024,3,半导体材料,31,光刻胶;硅片;掩膜版,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0024,4,晶圆制造,17,晶圆制造;制程节点;先进制程;成熟制程;晶圆厂,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0024,5,功率半导体,5,功率半导体;MOSFET;碳化硅;SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0024,6,化合物半导体,2,碳化硅;SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0024,7,关键零部件与厂务,1,洁净室,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0024,8,存储芯片,1,存储芯片,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0024,9,封装测试,1,先进封装,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0025,1,射频与连接芯片,41,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0025,2,数字计算与逻辑芯片,6,CPU;GPU;NPU;处理器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0025,3,半导体设备,3,CVD,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0025,4,封装测试,3,先进封装,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0025,5,模拟与混合信号,2,电源管理,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0025,6,传感器_MEMS与光电,1,传感器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0025,7,功率半导体,1,GaN,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0025,8,化合物半导体,1,GaN,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0026,1,射频与连接芯片,74,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0026,2,数字计算与逻辑芯片,8,CPU;NPU;FPGA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0026,3,传感器_MEMS与光电,2,传感器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0026,4,存储芯片,2,存储器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0026,5,芯片设计,2,SoC;EDA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0026,6,EDA与IP,1,EDA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0026,7,化合物半导体,1,砷化镓,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0026,8,半导体材料,1,封装材料,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0026,9,封装测试,1,先进封装,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0027,1,半导体设备,405,半导体设备;光刻;刻蚀;薄膜沉积;CVD;PVD;ALD;清洗设备;量测;检测设备;涂胶显影;离子注入;CMP,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0027,2,射频与连接芯片,41,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0027,3,半导体材料,27,光刻胶;硅片;靶材,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0027,4,晶圆制造,24,晶圆制造;晶圆代工;制程节点;先进制程;成熟制程;晶圆厂,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0027,5,关键零部件与厂务,3,石英;洁净室,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0027,6,封装测试,3,先进封装,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0027,7,存储芯片,2,存储芯片;DRAM,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0027,8,传感器_MEMS与光电,1,传感器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0027,9,数字计算与逻辑芯片,1,逻辑芯片,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0027,10,模拟与混合信号,1,模拟芯片,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0028,1,射频与连接芯片,30,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0028,2,EDA与IP,3,EDA;设计工具,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0028,3,数字计算与逻辑芯片,3,GPU,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0028,4,芯片设计,2,EDA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0029,1,射频与连接芯片,52,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0029,2,数字计算与逻辑芯片,44,CPU;GPU;AI芯片,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0029,3,功率半导体,9,SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0029,4,化合物半导体,9,SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0029,5,芯片设计,9,ASIC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0030,1,芯片设计,73,芯片设计;ASIC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0030,2,数字计算与逻辑芯片,72,CPU;GPU;NPU;AI芯片;逻辑芯片,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0030,3,功率半导体,68,SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0030,4,化合物半导体,68,SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0030,5,封装测试,52,先进封装;Chiplet;CoWoS;HBM,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0030,6,射频与连接芯片,51,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0030,7,传感器_MEMS与光电,35,MEMS;光模块,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0030,8,存储芯片,34,存储器;HBM,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0030,9,半导体设备,3,量测,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0030,10,晶圆制造,3,制程节点;先进制程,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0030,11,模拟与混合信号,2,电源管理;DAC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0030,12,EDA与IP,1,Arm架构,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0031,1,射频与连接芯片,39,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0031,2,半导体设备,5,半导体设备;量测,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0031,3,传感器_MEMS与光电,3,光模块,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0032,1,传感器_MEMS与光电,113,光模块,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0032,2,射频与连接芯片,47,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0032,3,模拟与混合信号,19,模拟芯片;电源管理;信号链;ADC;DAC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0032,4,半导体设备,10,检测设备,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0032,5,数字计算与逻辑芯片,10,AI芯片;处理器;FPGA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0032,6,功率半导体,7,功率半导体;功率器件;SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0032,7,化合物半导体,5,化合物半导体;SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0032,8,芯片设计,5,SoC;ASIC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0032,9,封装测试,2,测试机,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0032,10,关键零部件与厂务,1,洁净室,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0032,11,存储芯片,1,存储器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0032,12,晶圆制造,1,晶圆制造,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0033,1,射频与连接芯片,34,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0033,2,传感器_MEMS与光电,2,传感器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0034,1,射频与连接芯片,28,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0034,2,数字计算与逻辑芯片,19,CPU;NPU;AI芯片;处理器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0034,3,存储芯片,10,DRAM,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0034,4,芯片设计,4,SoC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0035,1,数字计算与逻辑芯片,43,CPU;GPU,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0035,2,射频与连接芯片,34,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0035,3,传感器_MEMS与光电,1,光模块,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0035,4,半导体设备,1,半导体设备,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0036,1,射频与连接芯片,44,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0036,2,半导体材料,1,靶材,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0038,1,射频与连接芯片,34,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0038,2,传感器_MEMS与光电,18,传感器;激光雷达,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0038,3,数字计算与逻辑芯片,5,GPU;NPU;算力芯片,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0038,4,功率半导体,4,SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0038,5,化合物半导体,4,SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0038,6,存储芯片,1,存储芯片,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0039,1,射频与连接芯片,31,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0039,2,传感器_MEMS与光电,18,MEMS;传感器;光模块,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0040,1,射频与连接芯片,30,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0040,2,功率半导体,12,功率半导体;功率器件;SiC;GaN,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0040,3,化合物半导体,10,SiC;GaN,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0040,4,数字计算与逻辑芯片,10,CPU;GPU,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0040,5,芯片设计,7,ASIC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0041,1,射频与连接芯片,39,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0041,2,数字计算与逻辑芯片,14,CPU;GPU;算力芯片,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0041,3,功率半导体,10,功率器件;SiC;GaN,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0041,4,化合物半导体,9,SiC;GaN,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0041,5,芯片设计,9,ASIC;EDA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0041,6,传感器_MEMS与光电,8,光模块,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0041,7,EDA与IP,2,EDA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0041,8,关键零部件与厂务,1,密封件,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0041,9,半导体材料,1,半导体材料,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0041,10,封装测试,1,CoWoS,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0042,1,射频与连接芯片,63,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0042,2,传感器_MEMS与光电,6,传感器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0042,3,半导体设备,2,半导体设备;检测设备,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0042,4,数字计算与逻辑芯片,1,GPU,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0042,5,模拟与混合信号,1,ADC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0043,1,半导体设备,67,半导体设备;光刻;刻蚀;薄膜沉积;CVD;ALD;量测;检测设备;离子注入;CMP,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0043,2,射频与连接芯片,61,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0043,3,存储芯片,41,存储芯片;DRAM;NAND;存储器;HBM,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0043,4,封装测试,29,封装测试;先进封装;Chiplet;CoWoS;HBM;封测,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0043,5,晶圆制造,14,晶圆制造;晶圆代工;制程节点;先进制程;晶圆厂;产能利用率,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0043,6,传感器_MEMS与光电,9,传感器;激光雷达;光模块,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0043,7,数字计算与逻辑芯片,9,CPU;GPU;处理器;逻辑芯片,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0043,8,半导体材料,5,硅片,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0043,9,化合物半导体,4,SiC;砷化镓,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0043,10,功率半导体,3,SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0044,1,射频与连接芯片,50,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0044,2,传感器_MEMS与光电,15,传感器;激光雷达,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0044,3,功率半导体,1,SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0044,4,化合物半导体,1,SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0044,5,封装测试,1,测试机,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0044,6,数字计算与逻辑芯片,1,GPU,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0044,7,模拟与混合信号,1,电源管理,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0045,1,数字计算与逻辑芯片,52,CPU;GPU;NPU,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0045,2,射频与连接芯片,41,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0045,3,模拟与混合信号,9,ADC;DAC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0045,4,芯片设计,7,芯片设计;ASIC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0045,5,传感器_MEMS与光电,5,CIS;光模块,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0045,6,功率半导体,5,SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0045,7,化合物半导体,5,SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0046,1,射频与连接芯片,51,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0046,2,传感器_MEMS与光电,15,传感器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0046,3,半导体设备,11,半导体设备;光刻;检测设备,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0046,4,存储芯片,2,存储器;HBM,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0046,5,封装测试,2,HBM;测试机,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0046,6,数字计算与逻辑芯片,1,GPU,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0046,7,芯片设计,1,SoC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0047,1,数字计算与逻辑芯片,15,CPU;GPU;NPU,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0047,2,射频与连接芯片,10,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0047,3,传感器_MEMS与光电,1,光模块,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0047,4,存储芯片,1,HBM,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0047,5,封装测试,1,HBM,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0048,1,射频与连接芯片,22,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0048,2,传感器_MEMS与光电,12,传感器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0049,1,射频与连接芯片,79,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0049,2,传感器_MEMS与光电,31,MEMS;光模块,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0049,3,数字计算与逻辑芯片,20,CPU;GPU;处理器;算力芯片,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0049,4,化合物半导体,4,化合物半导体;砷化镓;GaAs,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0049,5,封装测试,2,先进封装;Chiplet,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0049,6,模拟与混合信号,2,DAC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0049,7,芯片设计,2,芯片设计;EDA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0049,8,EDA与IP,1,EDA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0049,9,半导体材料,1,半导体材料,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0050,1,射频与连接芯片,4,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0051,1,射频与连接芯片,3,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0052,1,射频与连接芯片,88,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0052,2,数字计算与逻辑芯片,12,CPU;GPU;算力芯片,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0052,3,功率半导体,9,功率半导体;MOSFET;功率器件;碳化硅;SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0052,4,化合物半导体,6,碳化硅;SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0052,5,存储芯片,5,HBM,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0052,6,封装测试,5,HBM,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0052,7,半导体设备,2,半导体设备;ALD,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0052,8,传感器_MEMS与光电,1,传感器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0053,1,射频与连接芯片,39,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0053,2,传感器_MEMS与光电,28,MEMS;传感器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0053,3,EDA与IP,3,EDA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0053,4,数字计算与逻辑芯片,3,GPU,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0053,5,芯片设计,3,EDA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0053,6,功率半导体,1,SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0053,7,化合物半导体,1,SiC,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0053,8,半导体设备,1,量测,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0054,1,射频与连接芯片,3,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0054,2,功率半导体,1,GaN,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0054,3,化合物半导体,1,GaN,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0055,1,射频与连接芯片,34,PA,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0055,2,传感器_MEMS与光电,1,传感器,BROKER_REPORT_SECONDARY_DISCOVERY
| SRC-PANDA-SEMI-0055,3,晶圆制造,1,产能利用率,BROKER_REPORT_SECONDARY_DISCOVERY
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