Cai
2 days ago 22384865fbdb92c4ce603c137b1cac52ab6450ba
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{
  "batch_id": "BATCH-STOCK-VALUATION-INDUSTRY-RESEARCH-GAPS-20260814-001",
  "ticker": "603005.SH",
  "company": "晶方科技",
  "as_of": "2026-08-13",
  "v2_status": "BLOCKED",
  "v2_failure": {
    "complete": false,
    "error": "SourceContractError: 网络请求失败:Remote end closed connection without response",
    "error_code": "E_CORE_INPUT",
    "error_type": "CoreInputError",
    "recorded_at": "2026-08-14T00:54:55.916+08:00",
    "rollback_errors": [],
    "run_id": "f0d8f8b7d9ac4fa497d6df4812f838cc",
    "schema_version": 2,
    "status": "BLOCKED"
  },
  "v2_runtime_package": "v2_603005_SH.failed-f0d8f8b7d9ac4fa497d6df4812f838cc",
  "v2_raw_artifact_hashes": [
    "15fc75b0dfc1c024b64070dea3238e55eeb7135b5d614742d294e99c26cd38ed",
    "290584845f616bbdb3d4520ffc01cc4db74cdf8d9192b6b30e8fe772c329177e",
    "4e55dac71e6d8cdf449830f23a4e1e1998bea7a96cbd91f18d361f876eda728b",
    "63ada0211c54fb73d7af21caacafd0aa9e21872fcb31cc0bc84c0b6111542aa6",
    "73105d9a8740cc3140dd3df431e61c30bc35a3f7946c6fe9ea592561a273d8a7",
    "7b8b6219b407f53622aa3fc54d0c82897f0f4b0dad3faf7d4996e4df45ee6e79",
    "aa03bec5b1da8e0cb9ec5518afac9ace9255d454bc56bea9150520232100f861",
    "d2438c15d3204c7433a822d1cf43680c3983c2776f87e8a40570f4e505c559a6"
  ],
  "market_contract": {
    "table": "trading_xuntou.cn_stock_kline_1d_front",
    "source": "xtquant",
    "source_batch_id": "FKL_20260813_161015_179d5321_1d_20260813_00013",
    "updated_at": "2026-08-13 16:20:29",
    "trade_date": "2026-08-13"
  },
  "quote_raw_hash": "",
  "share_proof": {
    "shares": 652171706.0,
    "shares_fallback": true,
    "shares_fallback_source": "statutory_report:report_shares",
    "report_shares": 652171706.0,
    "share_unit_correction": null,
    "static_total_shares": 652171706.0,
    "match_report": true,
    "quote_market_cap": null,
    "price_times_shares": 21586883468.600002,
    "gap_rate": 0.0
  },
  "industry_membership": {
    "industries": [
      "半导体"
    ],
    "layers": [
      "OFFICIAL_IDENTITY_INDEXED"
    ],
    "research_name": "晶方科技"
  },
  "bounded_gaps": [
    "V2 quote f124=0,端到端流程诚实阻断;正式估值用当前总股本/市值勾稽,股本历史日期无A1完全匹配时显式保留缺口。",
    "机构汇总缺逐家报告日期与明细,不把一致预期写成法定事实。"
  ],
  "checks": {
    "v1_qa": {
      "error_count": 0,
      "info_count": 0,
      "issues": [
        {
          "action": "拆解营运资本、资本开支与回款持续性。",
          "field": "metrics.annual_fcf",
          "issue_id": "QA-NEGATIVE-FCF",
          "message": "最近完整年度简化自由现金流为负。",
          "recalc_scope": "DCF 与现金流交叉验证",
          "severity": "WARNING"
        }
      ],
      "status": "PASS_WITH_WARNINGS",
      "warning_count": 1
    },
    "label": "偏贵",
    "base_low": 14.710799999999999,
    "base_high": 32.898399999999995,
    "optimistic_high": 64.09382399999998,
    "price": 33.1,
    "bubble_status": "泡沫-轻"
  }
}