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| {
| "batch_id": "BATCH-STOCK-VALUATION-INDUSTRY-RESEARCH-GAPS-20260814-001",
| "ticker": "603163.SH",
| "company": "圣晖集成",
| "as_of": "2026-08-13",
| "v2_status": "BLOCKED",
| "v2_failure": {
| "complete": false,
| "error": "ValueError: E_HISTORICAL_SHARES_UNPROVEN：quote f124 缺失或为 0",
| "error_code": "E_CORE_INPUT",
| "error_type": "CoreInputError",
| "recorded_at": "2026-08-14T00:54:56.622+08:00",
| "rollback_errors": [],
| "run_id": "34129f5d921043aeaa454e2095cfcb47",
| "schema_version": 2,
| "status": "BLOCKED"
| },
| "v2_runtime_package": "v2_603163_SH.failed-34129f5d921043aeaa454e2095cfcb47",
| "v2_raw_artifact_hashes": [
| "12f882d24cd9a7b25040c86194864eb68d7583c6426355e0441a73bf6b867410",
| "9a7359617ab966dfa34b571ff2063e2ba6299c2026f0ddcee70fc5578b6b948a",
| "b840e71b72316e448c7dcf219973ef0931960e4e1804362f08d1b4aa6c252424",
| "c668e1d3f729bd6078bca64b894f7d28153244a7fc79fbbb72cf38f75285dfc5",
| "d06f3855d70621fc14e5933714396a57a3fd506d6f4b2f7a711a0f25267f4e05",
| "d2438c15d3204c7433a822d1cf43680c3983c2776f87e8a40570f4e505c559a6",
| "d7ca26ff66f75443736a394d1a1998ba658a05557a47af139ec8472351fe6e8e",
| "ee94df291aa2979158bc627aef31831fcf58e09a67b0d66513341edd4f0518ec",
| "f3c91cba99cb6f90d4689dcf58fab5a2628e858a00a88bf858d76c218d4d0dd5",
| "f600bc76820b84abc1537d2aceae33351fce1a0cc6253cb52523ccdfe30abe10"
| ],
| "market_contract": {
| "table": "trading_xuntou.cn_stock_kline_1d_front",
| "source": "xtquant",
| "source_batch_id": "FKL_20260813_161015_179d5321_1d_20260813_00014",
| "updated_at": "2026-08-13 16:20:44",
| "trade_date": "2026-08-13"
| },
| "quote_raw_hash": "c668e1d3f729bd6078bca64b894f7d28153244a7fc79fbbb72cf38f75285dfc5",
| "share_proof": {
| "shares": 100000000.0,
| "shares_fallback": false,
| "shares_fallback_source": "eastmoney.market:f84",
| "report_shares": 100000000.0,
| "share_unit_correction": null,
| "static_total_shares": 100000000.0,
| "match_report": true,
| "quote_market_cap": 8531000000.0,
| "price_times_shares": 8531000000.0,
| "gap_rate": 0.0
| },
| "industry_membership": {
| "industries": [
| "半导体"
| ],
| "layers": [
| "PRIMARY_EVIDENCE_ENRICHED_WITH_EXPLICIT_GAPS"
| ],
| "research_name": "圣晖集成"
| },
| "bounded_gaps": [
| "V2 quote f124=0，端到端流程诚实阻断；正式估值用当前总股本/市值勾稽，股本历史日期无A1完全匹配时显式保留缺口。",
| "机构汇总缺逐家报告日期与明细，不把一致预期写成法定事实。"
| ],
| "checks": {
| "v1_qa": {
| "error_count": 0,
| "info_count": 0,
| "issues": [],
| "status": "PASS",
| "warning_count": 0
| },
| "label": "基本合理",
| "base_low": 59.6544,
| "base_high": 135.3696,
| "optimistic_high": 264.647568,
| "price": 85.31,
| "bubble_status": "未识别估值泡沫"
| }
| }
|
|
