Cai
2 days ago 22384865fbdb92c4ce603c137b1cac52ab6450ba
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{
  "batch_id": "BATCH-STOCK-VALUATION-INDUSTRY-RESEARCH-GAPS-20260814-001",
  "ticker": "688820.SH",
  "company": "盛合晶微",
  "as_of": "2026-08-13",
  "v2_status": "BLOCKED",
  "v2_failure": {
    "complete": false,
    "error": "SourceContractError: 网络请求失败:Remote end closed connection without response",
    "error_code": "E_CORE_INPUT",
    "error_type": "CoreInputError",
    "recorded_at": "2026-08-14T00:55:12.753+08:00",
    "rollback_errors": [],
    "run_id": "3ce77f269e3b42d3b9ea8992d6bb48b1",
    "schema_version": 2,
    "status": "BLOCKED"
  },
  "v2_runtime_package": "v2_688820_SH.failed-3ce77f269e3b42d3b9ea8992d6bb48b1",
  "v2_raw_artifact_hashes": [
    "36b71d45fe3b2d892825e08def74655fb7a135645014cbdbf5b5616de80c366b",
    "3aa398527fa5a625cc506146fcdaf33999efee2a6219a36e1019f79be05e3d91",
    "3b864bded4cefffd462f4f2765b28299fd008fcbf768d0f294a09d8268f87d83",
    "74190eef6a871487c4ec8ab9ae92135fff835f65c67660e08b8328148269553e",
    "a1e461dbb9552ac18decf6e503fd74f0d3ae796e5c503908f8111f93fb7763e4",
    "d2438c15d3204c7433a822d1cf43680c3983c2776f87e8a40570f4e505c559a6",
    "de642534c8d6ed3fc44c6700ce44f89e3d8b519f98003027c05a7e89411a3e4c",
    "ebdf8e14ff70bcc2e5b6c42b9981dd417e364c9815bad59c263fc1b5ea8083f4"
  ],
  "market_contract": {
    "table": "trading_xuntou.cn_stock_kline_1d_front",
    "source": "xtquant",
    "source_batch_id": "FKL_20260813_161015_179d5321_1d_20260813_00018",
    "updated_at": "2026-08-13 16:21:48",
    "trade_date": "2026-08-13"
  },
  "quote_raw_hash": "",
  "share_proof": {
    "shares": 1092965800.0,
    "shares_fallback": true,
    "shares_fallback_source": "statutory_report:report_shares",
    "report_shares": 109296.58,
    "share_unit_correction": "report_shares_wan_to_shares_inferred_from_equity_scale",
    "static_total_shares": null,
    "match_report": false,
    "quote_market_cap": null,
    "price_times_shares": 147954780346.0,
    "gap_rate": 0.0
  },
  "industry_membership": {
    "industries": [
      "半导体"
    ],
    "layers": [
      "OFFICIAL_IDENTITY_INDEXED"
    ],
    "research_name": "盛合晶微"
  },
  "bounded_gaps": [
    "V2 quote f124=0,端到端流程诚实阻断;正式估值用当前总股本/市值勾稽,股本历史日期无A1完全匹配时显式保留缺口。",
    "机构汇总缺逐家报告日期与明细,不把一致预期写成法定事实。"
  ],
  "checks": {
    "v1_qa": {
      "error_count": 0,
      "info_count": 0,
      "issues": [
        {
          "action": "拆解营运资本、资本开支与回款持续性。",
          "field": "metrics.annual_fcf",
          "issue_id": "QA-NEGATIVE-FCF",
          "message": "最近完整年度简化自由现金流为负。",
          "recalc_scope": "DCF 与现金流交叉验证",
          "severity": "WARNING"
        }
      ],
      "status": "PASS_WITH_WARNINGS",
      "warning_count": 1
    },
    "label": "明显偏贵",
    "base_low": 21.42934164407523,
    "base_high": 46.38822191188049,
    "optimistic_high": 90.68897383772637,
    "price": 135.37,
    "bubble_status": "泡沫-极端"
  }
}