Cai
2 days ago 22384865fbdb92c4ce603c137b1cac52ab6450ba
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{
  "batch_id": "BATCH-STOCK-VALUATION-QINGFENGPU-TIMELINE-20260825-001",
  "ticker": "300604.SZ",
  "company": "长川科技",
  "as_of": "2026-08-25",
  "v2_status": "BLOCKED",
  "v2_failure": {
    "complete": false,
    "error": "SourceContractError: 网络请求失败:Remote end closed connection without response",
    "error_code": "E_CORE_INPUT",
    "error_type": "CoreInputError",
    "recorded_at": "2026-08-25T20:13:14.273+08:00",
    "rollback_errors": [],
    "run_id": "1b284317d78d4b23aa17d0255d326dad",
    "schema_version": 2,
    "status": "BLOCKED"
  },
  "v2_runtime_package": "v2_300604_SZ.failed-1b284317d78d4b23aa17d0255d326dad",
  "v2_raw_artifact_hashes": [
    "0e63b80d7232b1b106f94b596e84622e5d2b922cd537f4f90fd2fda11d9c836c",
    "589b213eab991be43bd636ba5fc4571e5d622066c85e3d6d22450bed26f5a9e7",
    "6187390c6f023138c97ed144ad647cda88441f06c38d7be272ed03b219d3c5e0",
    "6900da5b6b7aa87f0af473314c195c96e0e13cd64e70e1f7a2973e2216bbf35c",
    "776a16714cafb0a1898367fdc7075d2e56fa96c80b8c7e3097676f02c0cec18a",
    "a02b976e06f4e4d6d4e1526a3085c830769a17fea2bbd665d08170014a1d11c0",
    "c048e4db410dd21f47cfec94c009d2e088549da04dec594b4672de32cc062247",
    "d6e90ce08bc0cba2101c42e8283f365117854ef35dc2c75e6fa6026b261dcca6"
  ],
  "market_contract": {
    "table": "trading_xuntou.cn_stock_kline_1d_front",
    "source": "xtquant",
    "source_batch_id": "FKL_20260825_161021_6bd1f63d_1d_20260825_00007",
    "updated_at": "2026-08-25 16:37:26",
    "trade_date": "2026-08-25"
  },
  "quote_raw_hash": "",
  "share_proof": {
    "shares": 632779813.0,
    "shares_fallback": true,
    "shares_fallback_source": "statutory_report:report_shares",
    "report_shares": 632779813.0,
    "share_unit_correction": null,
    "static_total_shares": 634402614.0,
    "match_report": true,
    "quote_market_cap": null,
    "price_times_shares": 166813414303.06,
    "gap_rate": 0.0
  },
  "industry_membership": {
    "industries": [
      "半导体"
    ],
    "layers": [
      "overview",
      "reverse:半导体制造、设备、零部件和材料",
      "timeline"
    ],
    "research_name": "长川科技"
  },
  "bounded_gaps": [
    "V2 quote f124=0,端到端流程诚实阻断;正式估值用当前总股本/市值勾稽,股本历史日期无A1完全匹配时显式保留缺口。",
    "机构汇总缺逐家报告日期与明细,不把一致预期写成法定事实。"
  ],
  "checks": {
    "v1_qa": {
      "error_count": 0,
      "info_count": 0,
      "issues": [],
      "status": "PASS",
      "warning_count": 0
    },
    "label": "偏贵",
    "base_low": 82.5708000000078,
    "base_high": 187.37220000001767,
    "optimistic_high": 373.49525200003524,
    "price": 263.62,
    "bubble_status": "泡沫-中"
  }
}