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| {
| "batch_id": "BATCH-STOCK-VALUATION-QINGFENGPU-TIMELINE-20260825-001",
| "ticker": "301511.SZ",
| "company": "德福科技",
| "as_of": "2026-08-25",
| "v2_status": "BLOCKED",
| "v2_failure": {
| "complete": false,
| "error": "SourceContractError: 网络请求失败：Remote end closed connection without response",
| "error_code": "E_CORE_INPUT",
| "error_type": "CoreInputError",
| "recorded_at": "2026-08-25T19:57:08.631+08:00",
| "rollback_errors": [],
| "run_id": "53fa1d8cdaa84e3e9a15547f2a349f4b",
| "schema_version": 2,
| "status": "BLOCKED"
| },
| "v2_runtime_package": "v2_301511_SZ.failed-53fa1d8cdaa84e3e9a15547f2a349f4b",
| "v2_raw_artifact_hashes": [
| "4a015bda4193c556dbf970d0b3379707eb109744a514d378742e1290fe40b3a0",
| "4ab69bd2f6ef26ba90ffc7856168ac78f323206adca21bcf5f063334dd38f053",
| "75e6ee1a19c2ca10beb1a672038763bb91c59d1f3552f6cb2c6014810855b674",
| "7b26298b24b6817c5bcd3207992d8b8c6946296549a8c139e78f263fa482b56a",
| "805de985fbffd3d5d006b88ee790b6f93decca705fd9123eb5f28de3af0b86cb",
| "9971a0c2ad0bbe0ed88a73e5d4f4b81be7f7bc946572a194a1295a2651bdfd68",
| "a02b976e06f4e4d6d4e1526a3085c830769a17fea2bbd665d08170014a1d11c0",
| "c6404457cc0209666e0714c8d3a61d87f2f438a758151ef0a4e86cac3eb953d9"
| ],
| "market_contract": {
| "table": "trading_xuntou.cn_stock_kline_1d_front",
| "source": "xtquant",
| "source_batch_id": "FKL_20260825_161021_6bd1f63d_1d_20260825_00010",
| "updated_at": "2026-08-25 16:38:03",
| "trade_date": "2026-08-25"
| },
| "quote_raw_hash": "",
| "share_proof": {
| "shares": 630322000.0,
| "shares_fallback": true,
| "shares_fallback_source": "statutory_report:report_shares",
| "report_shares": 630322000.0,
| "share_unit_correction": null,
| "static_total_shares": 630322000.0,
| "match_report": true,
| "quote_market_cap": null,
| "price_times_shares": 51358636560.0,
| "gap_rate": 0.0
| },
| "industry_membership": {
| "industries": [
| "半导体"
| ],
| "layers": [
| "reverse:半导体制造、设备、零部件和材料",
| "timeline"
| ],
| "research_name": "德福科技"
| },
| "bounded_gaps": [
| "V2 quote f124=0，端到端流程诚实阻断；正式估值用当前总股本/市值勾稽，股本历史日期无A1完全匹配时显式保留缺口。",
| "机构汇总缺逐家报告日期与明细，不把一致预期写成法定事实。"
| ],
| "checks": {
| "v1_qa": {
| "error_count": 0,
| "info_count": 0,
| "issues": [
| {
| "action": "拆解营运资本、资本开支与回款持续性。",
| "field": "metrics.annual_fcf",
| "issue_id": "QA-NEGATIVE-FCF",
| "message": "最近完整年度简化自由现金流为负。",
| "recalc_scope": "DCF 与现金流交叉验证",
| "severity": "WARNING"
| }
| ],
| "status": "PASS_WITH_WARNINGS",
| "warning_count": 1
| },
| "label": "偏贵",
| "base_low": 31.7460000000078,
| "base_high": 72.0390000000177,
| "optimistic_high": 143.59774000003526,
| "price": 81.48,
| "bubble_status": "泡沫-轻"
| }
| }
|
|
