Cai
2 days ago 22384865fbdb92c4ce603c137b1cac52ab6450ba
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{
  "batch_id": "BATCH-STOCK-VALUATION-QINGFENGPU-TIMELINE-20260825-001",
  "ticker": "688432.SH",
  "company": "有研硅",
  "as_of": "2026-08-25",
  "v2_status": "BLOCKED",
  "v2_failure": {
    "complete": false,
    "error": "SourceContractError: 网络请求失败:Remote end closed connection without response",
    "error_code": "E_CORE_INPUT",
    "error_type": "CoreInputError",
    "recorded_at": "2026-08-25T20:13:31.369+08:00",
    "rollback_errors": [],
    "run_id": "41991f367eed4256a2029dea4a4207b0",
    "schema_version": 2,
    "status": "BLOCKED"
  },
  "v2_runtime_package": "v2_688432_SH.failed-41991f367eed4256a2029dea4a4207b0",
  "v2_raw_artifact_hashes": [
    "04f255829b0f097f191db685dd28a1dc88785853bd0b0e96199c5458ed90bfcf",
    "0cdd6606bf9554cbccb7efed973330d9bc0cd51f403265a5082e4291b6b045b0",
    "419e335d4457895ea50425ef592bd1e58153b5723a8557e4792bb17a3bd0d294",
    "7a887c80f65f95728ea14bb8a979b5d280691e50e0fb86b3d394d5f9819de989",
    "a02b976e06f4e4d6d4e1526a3085c830769a17fea2bbd665d08170014a1d11c0",
    "bd5519713ddac099638ae8157725f7173bda8e33e33e22cbf50c786b5cd48d3e",
    "e319f690d90967f5dc10a86d7cdf63d06cdd4e9f345695b70c848a902eb02c53",
    "ecfdb7e8befd74b73ae76aca8a2b2f22c64a93c9a079a0cb6950452a2dad008d"
  ],
  "market_contract": {
    "table": "trading_xuntou.cn_stock_kline_1d_front",
    "source": "xtquant",
    "source_batch_id": "FKL_20260825_161021_6bd1f63d_1d_20260825_00017",
    "updated_at": "2026-08-25 16:39:32",
    "trade_date": "2026-08-25"
  },
  "quote_raw_hash": "",
  "share_proof": {
    "shares": 1250301858.0,
    "shares_fallback": true,
    "shares_fallback_source": "statutory_report:report_shares",
    "report_shares": 1250301858.0,
    "share_unit_correction": null,
    "static_total_shares": 1250301858.0,
    "match_report": true,
    "quote_market_cap": null,
    "price_times_shares": 56538650018.76,
    "gap_rate": 0.0
  },
  "industry_membership": {
    "industries": [
      "半导体"
    ],
    "layers": [
      "reverse:半导体制造、设备、零部件和材料",
      "timeline"
    ],
    "research_name": "有研硅"
  },
  "bounded_gaps": [
    "V2 quote f124=0,端到端流程诚实阻断;正式估值用当前总股本/市值勾稽,股本历史日期无A1完全匹配时显式保留缺口。",
    "机构汇总缺逐家报告日期与明细,不把一致预期写成法定事实。"
  ],
  "checks": {
    "v1_qa": {
      "error_count": 0,
      "info_count": 0,
      "issues": [],
      "status": "PASS",
      "warning_count": 0
    },
    "label": "明显偏贵",
    "base_low": 4.914,
    "base_high": 11.894399999999997,
    "optimistic_high": 23.253551999999992,
    "price": 45.22,
    "bubble_status": "泡沫-极端"
  }
}