Cai
13 hours ago 5486169ced2815e7bce92feb209f7bd0093d4639
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{
  "batch_id": "BATCH-STOCK-VALUATION-QINGFENGPU-TIMELINE-20260825-001",
  "ticker": "688531.SH",
  "company": "日联科技",
  "as_of": "2026-08-25",
  "v2_status": "BLOCKED",
  "v2_failure": {
    "complete": false,
    "error": "SourceContractError: 网络请求失败:Remote end closed connection without response",
    "error_code": "E_CORE_INPUT",
    "error_type": "CoreInputError",
    "recorded_at": "2026-08-25T19:57:33.669+08:00",
    "rollback_errors": [],
    "run_id": "59e85c9be33b4d38ad26d3249c830cdd",
    "schema_version": 2,
    "status": "BLOCKED"
  },
  "v2_runtime_package": "v2_688531_SH.failed-59e85c9be33b4d38ad26d3249c830cdd",
  "v2_raw_artifact_hashes": [
    "0fce33664a6b6c9bd75fb3d6be712d538d6f8888114a6e22f549b8f0b0edb9c9",
    "2443eb9d29e180b088f71d3d17988d999c693f598f5791b4255ef5f94e93de89",
    "50522566cf62c716e84b6ac925b2883f3c8e002e42020b6389f1619a53317a5c",
    "5142dd3e7c67fc10de22d6f62f1dc34ba6092ea876c3f00c26a81ca3f0011f17",
    "54ef57c446a346f7ea8b3f1cae3737c0a379b83d90afabad064515477366f585",
    "69e06cecae3729fc6579776a65988542a9e3c1121046416bd314cd2d76745553",
    "a02b976e06f4e4d6d4e1526a3085c830769a17fea2bbd665d08170014a1d11c0",
    "fbedee8797cd7de085bf056c7a497655194607398d3e6f9fdca518aa64710f0b"
  ],
  "market_contract": {
    "table": "trading_xuntou.cn_stock_kline_1d_front",
    "source": "xtquant",
    "source_batch_id": "FKL_20260825_161021_6bd1f63d_1d_20260825_00017",
    "updated_at": "2026-08-25 16:39:32",
    "trade_date": "2026-08-25"
  },
  "quote_raw_hash": "",
  "share_proof": {
    "shares": 165593939.0,
    "shares_fallback": true,
    "shares_fallback_source": "statutory_report:report_shares",
    "report_shares": 165593939.0,
    "share_unit_correction": null,
    "static_total_shares": 165593939.0,
    "match_report": true,
    "quote_market_cap": null,
    "price_times_shares": 22194555644.170002,
    "gap_rate": 0.0
  },
  "industry_membership": {
    "industries": [
      "半导体"
    ],
    "layers": [
      "reverse:半导体制造、设备、零部件和材料",
      "timeline"
    ],
    "research_name": "日联科技"
  },
  "bounded_gaps": [
    "V2 quote f124=0,端到端流程诚实阻断;正式估值用当前总股本/市值勾稽,股本历史日期无A1完全匹配时显式保留缺口。",
    "机构汇总缺逐家报告日期与明细,不把一致预期写成法定事实。"
  ],
  "checks": {
    "v1_qa": {
      "error_count": 0,
      "info_count": 0,
      "issues": [
        {
          "action": "拆解营运资本、资本开支与回款持续性。",
          "field": "metrics.annual_fcf",
          "issue_id": "QA-NEGATIVE-FCF",
          "message": "最近完整年度简化自由现金流为负。",
          "recalc_scope": "DCF 与现金流交叉验证",
          "severity": "WARNING"
        }
      ],
      "status": "PASS_WITH_WARNINGS",
      "warning_count": 1
    },
    "label": "偏贵",
    "base_low": 45.80550000000001,
    "base_high": 103.94325,
    "optimistic_high": 207.193545,
    "price": 134.03,
    "bubble_status": "泡沫-中"
  }
}